Plating Technology
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The main techplating technology based on theory and
experience is used in a wide range of industries
such as electronic components, semiconductor,
automobile, medical, space, and precision machinery.

I can electrolytic plating or electroless plating semiconductor wafer

UBM fabrication by electroless plating or bump-fabrication of several tens of micrometer by electroplating, on the electrodes (Al or Cu) of of semiconductor wafers

Technical name The main technical introduction to content
Plating technology for semiconductor wafers It is the introduction of plating technology to the semiconductor wafer.

Plating technology for powder-form materials:
By a nanometer-scale metal layer plating, additional properties such as conductivity, abrasion resistance , corrosion resistance, and sinterability are added to micrometer-scale powder-form-materials which have one originally.

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Plating technology for powder-form materials I can be plated on the powder material

We may meet your request for SMDs such as 0603 or 0402 devices by our application performance and achievement

Technical name The main technical introduction to content
Plating technology for small SMD We may meet your request for SMDs such as 0603 or 0402 devices

Cu filling into through-silicon via (TSV) by plating.
KIYOKAWA takes TSV plating from seed metal plating to filling with our original technology to meet your requirements.

Technical name The main technical introduction to content
Plating technology for TSV Cu filling into through-silicon via (TSV) by plating.

Mass production technology based on our achievements and know-how in 35 years !! High quality, short lead time, and low cost for your products.

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Barrel plating In barrel plating method, plating can be a large amount at one time a small product

Plating on ceramic boards such as LTCC (Low Temperature Co-fired Ceramics) boards or resinous boards for the purpose of solder junction or wire bonding

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Plating technology for ceramic and resinous printing writing boards Plating on ceramic boards such as LTCC (Low Temperature Co-fired Ceramics) boards

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Plating technology for medical-use materials Improvement of health-related society through the integration of medical and plating technology
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